METHOD OF MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board capable of surely filling through holes as vias with an electrically conductive paste without carrying out troublesome work such as vacuum suction. SOLUTION: In the method, the printed wiring board is manufactured through interlayer connection using an electrically conductive paste 1. The method includes the steps of providing the through holes 3 for vias to the insulating material 2, superposing a support 4 on one surface of an insulating material 2, fixing the insulating material 2 and the support 4 temporarily by bringing them into partial and intimate contact with each other, and filling the through holes 3 as the vias with the conductive paste 1. COPYRIGHT: (C)2008,JPO&INPIT