| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for connecting wiring boards which provides sufficient adhesion reliability and does not cause poor connection even when the sum of heights of electrodes facing each other is larger than 30μm, and a method of connecting wiring boards to bond two wiring boards having wired circuits on substrate surfaces using the film for connecting wiring boards, thereby connecting the wired circuits of two wiring boards to each other. SOLUTION: In the film for connecting wiring boards consisting of a thermosetting resin composition in which conductive particles are dispersed, the curing reactivity increases from one surface of a film toward the other surface, or increases from both surfaces of the film toward the center. In the method of connecting wiring boards, the film for connecting wiring boards is held between the two wiring boards having wired circuits on a surface of the substrate, heated and pressed. COPYRIGHT: (C)2008,JPO&INPIT
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