| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of being applied in a large film thickness, capable of obtaining a cured product of high resolution and suitable for a surface protective film, an interlayer dielectric and an insulation film for a high density mounted substrate. <P>SOLUTION: The photosensitive resin composition comprises (A) a polyimide resin, (B) a resin having a phenolic hydroxyl group, (C) a photoacid generator and (D) a crosslinking agent. <P>COPYRIGHT: (C)2008,JPO&INPIT |
