发明名称 MULTILAYERED WAFER, ITS MANUFACTURING METHOD, AND ITS INSPECTION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayered wafer of stacked thin films, a method of manufacturing the multilayered wafer, and an apparatus for inspecting the wafer, which can detect positional displacements between patterns of the layers with a small error amount and less fluctuations in direction, can detect the positional displacements in a short time with a simple arrangement, and can make small an occupied surface area of overlay markers on the multilayered thin films. <P>SOLUTION: Overlay markers 62a, 70a, 66a for detecting relative positional displacements between patterns 62, 66, 70 of layers are provided to each of the layers. The overlay markers 62a, 70a, 66a are provided so that from the observation position of the specific overlay marker 70a of at least one of the layers, the overlay markers 62a, 66a of the layers other than the at least one of the layers can be observed. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008085007(A) 申请公布日期 2008.04.10
申请号 JP20060261891 申请日期 2006.09.27
申请人 FUJITSU LTD 发明人 HIROSE KOICHI;SHIMIZU YOSHIAKI
分类号 H01L21/027;G03F9/00;G11B5/31 主分类号 H01L21/027
代理机构 代理人
主权项
地址