| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inexpensive chip resistor 10 in which such drawbacks as fatigue, crack, fracture, and the like, due to thermal stress can be prevented at the solder joint 32 of an electronic circuit board 30 and a back electrode 13. <P>SOLUTION: Burnt silver containing a glass component and adhering rigidly to a ceramic insulating substrate 11 is applied as a first back electrode 14 directly to the backside of the insulating substrate 11, and a second back electrode 15 composed of resin silver having a lower Young's modulus as compared with burnt silver and exhibiting thermal stress relaxation effect is stacked on the first back electrode 14 thus forming a two layer structure. A back electrode 13 is bonded rigidly to the insulating substrate 11 and occurrence of fatigue, crack, and fracture due to thermal stress is prevented when it is mounted on an electronic circuit board 30 thus enhancing durability life of a chip resistor 10. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
