METHOD FOR FORMING MICRO WIRING

摘要

PROBLEM TO BE SOLVED: To provide a micro wiring forming method for forming a micro wiring in which adhesive strength is improved by using a metal thin film sacrifice layer and the diffusion of an ink can be controlled. SOLUTION: The method for forming the micro wiring comprises (a) a stage of preparing a printed circuit board 10; (b) a stage of forming a metal thin film sacrifice layer 20 with a first metal nano ink in the surface of the printed circuit board 10; (c) a stage of forming wiring 30 with a second metal nano ink on a metal thin film sacrifice layer 20 by an ink jet method; and (d) a stage of removing a part of metal thin film sacrifice layer 20 and forming wiring pattern (20, 30) with a remaining part of the metal thin film sacrifice layer 20 and the wiring 30. COPYRIGHT: (C)2008,JPO&INPIT