| 摘要 |
PROBLEM TO BE SOLVED: To remove deposited adherents without imposing damage on aluminum and an anodized aluminum oxide base material as a process chamber base material as a semiconductor device. SOLUTION: A semiconductor manufacturing apparatus is cleaned without imposing damage on a base material by using a composition for cleaning the semiconductor manufacturing apparatus which contains a kind of a fluoride selected from among a sodium fluoride, a potassium fluoride, a lithium fluoride and an ammonium fluoride; a citric acid; and a pH adjuster represented by ammonia as required. COPYRIGHT: (C)2008,JPO&INPIT
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