| 摘要 |
PROBLEM TO BE SOLVED: To effectively alleviate thermal stress caused by a difference in thermal expansion coefficients between a heating utensil 1 and a table 6. SOLUTION: The rear-face electron-bombardment heating device is provided with a filament 9 fitted in the rear of a heating plate 2 as a top plate of the heating vessel 1, a heating power source 12 heating the filament 9, and an accelerating power source 7 impressing an accelerating voltage on the filament 9. A vacuum seal 14 is pinched between a top face of the table 6 mounting the heating vessel 1 and a lower-end flange part 18 of a side wall 13 of the heating vessel 1, and further, the lower-end flange part 18 is pressed down with a stud 4 through a buffer member 17 made of soft metal, and the stud 4 is fastened and fixed to the table 6 with a screw 19. COPYRIGHT: (C)2008,JPO&INPIT
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