| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive for electrode connection enabled to effectively restrain generation of voids, and, for instance, capable of improving connection reliability of a flexible printed wiring board and a wiring substrate in connecting the same through an adhesive. SOLUTION: A metal electrode 5 of a flexible printed wiring board 3 and a wiring electrode 4 of a wiring board 1 are connected through an adhesive for electrode connection 2 mainly composed of insulating thermosetting resin and containing conductive particles and a latent curing agent. Then, the adhesive for electrode connection 2 further contains insulating resin fine particles with an average particle size of 2μm or less, with a blended volume of the resin fine particles to the total of the adhesive for electrode connection 2 of 0.5 wt.% or more and 20 wt.% or less. COPYRIGHT: (C)2008,JPO&INPIT
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