SEMICONDUCTOR PACKAGE, AND DISPLAY

摘要

In a tape carrier type semiconductor package having an interposer substrate, connection terminals and wiring are provided on the interposer substrate and upsizing of a semiconductor package incident to upsizing of the interposer substrate is inevitable as the number of connection terminals increases. The inventive semiconductor package where a semiconductor chip is connected with a film substrate through the interposer substrate, characterized in that the semiconductor chip is provided with a plurality of terminals respectively on two opposing sides and connected, on the interposer substrate, while being shifted from the center of the interposer substrate to the side of one of two sides having a fewer terminals.