| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesion expression method, by which a heat required for achieving a desired adhesion by an adhesive film can be efficiently transmitted to the adhesive film, and adhesion expression equipment therefor. <P>SOLUTION: The adhesion equipment of an adhesive film 24 is equipped with: a wafer hold means 25 for holding a wafer 20 in the state of turning up a rear face 22 of the wafer 20 on which a front surface protection film 3 is pasted; an adhesive film paste means for pasting the adhesive film on the rear face of the wafer held by the wafer hold means; and a heating means 41 which is arranged so as to be faced to the rear face of the wafer held by the wafer hold means and heats the adhesive film pasted on the rear face of the wafer. The heating means may be a plurality of heating lamps. Moreover, the wafer hold means may contain cooling means 26. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
