| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate and a semiconductor device using the same which can pinpoint correctly and easily the position of a test object portion, and can improve workability of visual check and failure analysis when performing failure analysis by visual inspection and probe inspection with regard to, for example, lands, arranged in large numbers. <P>SOLUTION: A land 22 is defined as a first land 25 which is arranged on every m line on land lines and every n line on land columns (m, n are natural number), and defined as a second land 26 which is not arranged as above. A solder resist 24a along the first land 25 is formed to be thick or thin compared with the solder resist 24b in the other regions. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
