| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable coreless substrate by effectively preventing the coreless substrate from being broken, and to provide a semiconductor substrate mounting structure using the same. SOLUTION: The coreless substrate comprises: a first insulant 5a having a first fiber layer 6a that is formed in a planar state; a second insulant 5b having a second fiber layer 6b that is disposed on the first insulant 5a and is formed in a planar state; and a conductor 4 that intervenes between the first insulant 5a and second insulant 5b. COPYRIGHT: (C)2008,JPO&INPIT
|
