| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method for sufficiently cleaning a semiconductor substrate and the like on which a micro-pattern is formed. SOLUTION: Prior to bringing a cleaning liquid (chemical 60) into contact with an object (a semiconductor substrate 50) for cleaning, vacuum deairing, contacting surfactant and an osmotic solution, and deairing through supersonic are performed to improve surface wettability of the object. With the wettability improved, the cleaning liquid gets into concave parts of the pattern on the semiconductor substrate, etc., where a micro-pattern is formed, and as a result, poor cleaning caused by inappropriate wettability is circumvented, attaining a good cleaning effect. In addition, applying pressure with a cleaning liquid in contact with a cleaned object after wettability improvement enables the cleaning liquid to be effectively impregnated up to micro-depressions of the cleaned object, thus further enhancing the cleaning effect. COPYRIGHT: (C)2008,JPO&INPIT
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