SPUTTERING APPARATUS

摘要

PROBLEM TO BE SOLVED: To improve a utilization ratio of a target by making an erosion depth of a circular arc part equivalent to that of other parts or shallower, and to reduce the replacement frequency of the target. SOLUTION: This sputtering apparatus has a magnetic circuit 20 installed such that the distance between the magnetic circuit 20 and the surface of the target 12 while the magnetic circuit 20 moves in a circular arc part RAis longer than that while it moves in a linear part RL, and controls the strength of a magnetic field on the surface of the target 12 in a circular arc part RAlower than that in the linear part RL. Then, an erosion depth in the circular arc part RAis decreased, and the life of the target 12 is extended. Instead of changing the distance, a weakening member for weakening the strength of the magnetic field on the surface of the target 12 may be placed in a circular arc part RA, or an intensifying member for intensifying the strength of the magnetic field on the surface of the target 12 can be placed in a linear part RL. COPYRIGHT: (C)2008,JPO&INPIT