EPOXY RESIN, PHENOL RESIN, THEIR PRODUCTION METHODS, EPOXY RESIN COMPOSITION AND CURED PRODUCT

摘要

Disclosed is an epoxy resin having excellent fluidity and high filler filling property, which provides a cured product excellent in moisture resistance, heat resistance and flame retardance. This epoxy resin is suitable for sealing of electronic components and uses as circuit board materials. Also disclosed is a composition of such an epoxy resin. Specifically disclosed is an epoxy resin represented by the general formula (3) below, which is obtained by reacting epichlorohydrin with a phenol resin which is obtained by reacting 0.2-6.0 moles of indene or acenaphthylene with 1 mole of a bisphenol compound represented by the general formula (2) below. (In the formulae, X represents a single bond, -CH₂-, -CH(CH₃)-, -C(CH₃)₂-, -CO-, -O-, -S- or -SO₂-; and R₁-R₄ independently represent a hydrogen atom or a substituent derived from indene or acenaphthylene.)