| 摘要 |
A method for manufacturing a light emitting device and its package having a vertical structure are provided to prevent damage of a semiconductor thin film during a laser lift-off process and reduce the number of processes and the processing time. Plural semiconductor layers(20) are formed on a substrate(10), and then a first electrode(30) is formed on the semiconductor layers. A metallic architecture layer(40) is formed on the first electrode. The substrate including the semiconductor layers is divided into unit devices. Each of the separated unit devices is attached to a sub-mount(60), and then the substrate is separated from the semiconductor layers. A second electrode is formed on the semiconductor layer. |
