PHOTOSENSITIVE RESIN COMPOSITION FOR FLEXIBLE CIRCUIT BOARD AND FLEXIBLE CIRCUIT BOARD OBTAINED BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a flexible circuit board having excellent flame retardancy and with non-halogenation for consideration of environmental aspects, and to provide the flexible circuit board obtained by using the same.

SOLUTION: The photosensitive resin composition for the flexible circuit board includes (A) a linear polymer containing a carboxyl group obtained by addition polymerizing an ethylenic unsaturated compound; (B) a polymerizable compound containing an ethylenic unsaturated group; (C) a photopolymerization initiator; and (D) a phosphorated epoxy resin containing phosphorous atoms at ≥2 wt.% based on a total molecular weight thereof. The flexible circuit board is obtained by forming a photosensitive resin composition layer on a conductor circuit pattern by using the photosensitive resin composition; and exposing the layer in a prescribed pattern; and developing it to form a cover insulation layer.

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