| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate-containing adhesive sheet for a flexible printed wiring board, which is free from the occurrence of the fall of a powder of a resin composition, during the processing into a multilayer flexible printed wiring board or a flex rigid printed wiring board, has high rigidity and is excellent in impregnating ability and can easily be processed. SOLUTION: This adhesive sheet 7 used for adhering a flexible printed wiring board 5 comprising a polyimide resin comprises a substrate of a woven cloth and a resin composition. The resin composition comprises (a) an epoxy resin having two or more epoxy groups in a molecule, (b) a polycarbodiimide resin having a≥2,000 and <10,000 number-average molecular weight and a 50% particle size (D<SB>50</SB>) of 5-15μm and a 90% particle size (D<SB>90</SB>) of less than 30μm, and (c) an imidazole-based curing agent, as inevitable components, where the ratio of the component (a) and the component (b) is in a range of 80:20 to 20:80 by mass. COPYRIGHT: (C)2008,JPO&INPIT |
