| 摘要 |
In a silicon substrate for a magnetic recording medium, a curved surface having a radius from 0.01 mm to 0.05 mm is provided at an edge portion between a main surface and an end face of the substrate. The curved surface may be provided at an outer periphery or an inner periphery of the substrate. Preferably, the maximum heights for surface roughness for the end face and the main surface are respectively 1 mum or less and 10 nm or less. A manufacturing method for a silicon substrate includes forming a circular hole at a center of the silicon substrate; immersing the substrate in a polishing liquid in which grains are suspended; and respectively polishing outer and inner peripheral end faces of the substrate. In polishing of each end face, a polishing brush contacts the end face while performing a relative rotation between the end face and the polishing brush.
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