| 摘要 |
A repair pre-soldering structure on a circuit board and a method thereof are proposed. A leave out on a circuit board without any pre-soldering is repaired by a micro-depositing process by applying micro droplets on the circuit board, or a short circuit formed by a pre-soldering with higher height is repaired by a micro-corrosion process. Therefore, the present invention improves fine rate of fabrication and avoids increasing fabricating time due to rework the circuit board, fabrication costs, and so on.
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