EPOXY RESIN COMPOSITION AND ELECTRONIC PART DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing having excellent fluidity and produced by using a silane compound effective for suppressing the agglomeration of an inorganic filler independent of the production method of the epoxy resin composition and the pretreatment method of the inorganic filler and provide an electronic part device having an element sealed by the epoxy resin composition. SOLUTION: The epoxy resin composition contains (A) an epoxy resin, (B) an inorganic filler and (C) a silane coupling agent having nitrogen atom bonded to an aryl group in the molecule. COPYRIGHT: (C)2008,JPO&INPIT