发明名称 |
FILM-FORMING APPARATUS, FILM-FORMING METHOD, INSULATION FILM, DIELECTRIC FILM, PIEZOELECTRIC FILM, FERROELECTRIC FILM, PIEZOELECTRIC ELEMENT AND LIQUID DISCHARGE DEVICE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To stably form a film of high quality in a film-forming apparatus and a film-forming method using plasma. <P>SOLUTION: In a film-forming apparatus 300 including a vacuum chamber 310 having a gas inlet for a film-forming gas G and a gas outlet, a target holder 12 disposed in the vacuum chamber 310 to hold a target T, a substrate holder 11 opposed to the target holder 12 and holding a film-forming substrate B, and plasma forming portions 12, 13 generating a plasma space P between the target holder 12 and the film-forming substrate, a shield 250 is provided. The shield 250 surrounds the outer peripheral surface of the target holder 12 facing the substrate, and comprises a plurality of shield layers 250a having a gap 204 thorough which the film-forming gas G passes so as to be disposed in a noncontact state with the target T in such a manner that they are lapped with intervals to the upper and lower directions. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
申请公布号 |
JP2008081803(A) |
申请公布日期 |
2008.04.10 |
申请号 |
JP20060263981 |
申请日期 |
2006.09.28 |
申请人 |
FUJIFILM CORP |
发明人 |
FUJII TAKAMITSU |
分类号 |
C23C14/34;B41J2/14;B41J2/16;C23C14/08;H01L21/316;H01L41/09;H01L41/18;H01L41/187;H01L41/316;H01L41/39 |
主分类号 |
C23C14/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|