| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology which can elevate the reliability of a semiconductor integrated circuit device. <P>SOLUTION: In a wafer manufacturing stage, a visual inspection of a semiconductor integrated circuit device WPP100, on both sides of whose bump a rewiring layer is formed, is conducted in a manner such that a process which takes a picture of it by a camera 202 irradiating light from a coaxially down-irradiating illuminator 204 in a coaxially down-irradiating direction and a process which takes a picture of it by a camera 202 irradiating light from a diffusion illuminator 205 in a direction crossing the taking-a-photo direction are changed in order, and a pattern matching is conducted between a previously obtained image and a previously pictured teaching image, thereby, it is determined whether there is a defect. <P>COPYRIGHT: (C)2008,JPO&INPIT |
