发明名称 HIGH FREQUENCY CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a high frequency circuit board capable of virtually grounding a chip side and efficiently converting a transmission mode. <P>SOLUTION: A microstrip line 10 comprises a signal strip conductor 11 and a ground conductor 15. A coplanar line 20 comprises a signal strip conductor 21 connected with the signal strip conductor 11 by a wire 24, an area 20a composed of a ground strip conductor 22 continued to the ground conductor 15, and an area 20b where a ground strip conductor 23 connected by through-hole is formed at the upper part of the ground strip conductor 22. The transmission mode is changed in the order of the microstrip line 10, the area 20a and the area 20b. Thus, the transmission mode is efficiently converted from the microstrip line to the coplanar line. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008085796(A) 申请公布日期 2008.04.10
申请号 JP20060264806 申请日期 2006.09.28
申请人 TOYOTA CENTRAL R&D LABS INC;DENSO CORP 发明人 UDA NAONORI;KATAYAMA TETSUYA
分类号 H01P5/08;H01L23/12;H01P3/08 主分类号 H01P5/08
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