PATTERN FORMING METHOD AND COATING FILM FORMING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a new pattern forming method capable of reducing the number of steps in a double patterning process, and a coating film forming material suitable for use in the pattern forming method.

SOLUTION: A first chemically amplified resist composition is applied on a support 1 to form a first resist film 2. The first resist film 2 is selectively exposed and developed to form a plurality of first resist patterns 3. Coating films 4 comprising a water-soluble resin film are formed on the respective surfaces of the first resist patterns 3 to form a plurality of coated patterns 5. A second chemically amplified resist composition is applied on the support 1 on which the coated patterns 5 have been formed to form a second resist film 6. The second resist film 6 is selectively exposed and developed to form a pattern comprising the plurality of coated patterns 5 and second resist patterns 7 formed of the second resist film 6 on the support 1.

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