| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a low-temperature fired ceramic circuit board in which a secular change in a resistance value is suppressed by reducing a thermal load of an uppermost resistor. <P>SOLUTION: The low-temperature fired ceramic circuit board has a configuration in which the uppermost resistor 4 for crosslinking between a pair of electrodes 3 and 3 is provided on an uppermost layer 1a of a low-temperature fired ceramic board 1. In the circuit board, heat radiation vias 8 are provided immediately below the electrodes 3 so that a heat radiation material 7 made of an Ag-based conductor having a high heat transfer rate can conduct to each of the electrodes 3 and the bottom surface of the heat radiation material 7 is exposed to the outside of the ceramic substrate 1. The heat radiation vias 8 are each configured by filling the heat radiation material 7 into through holes 6 of the ceramic substrate 1. In this structure, pores each having a dimension of the through hole 6 cut crosswise are previously formed on each green sheet of the multi-layered ceramic substrate 1 and the heat radiation material 7 are filled into each of the through holes. In this way, the green sheets are laminated to form multilayer, and the heat radiation vias 8 can be automatically obtained. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
