发明名称 DICING APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a dicing apparatus and method for processing a plurality of works simultaneously with high throughput at a low cost. SOLUTION: The dicing apparatus comprises a work table 2 provided with surfaces 11 and 12 for holding a work in parallel, a processing section 5 opposing the holding surface 11, a processing section 6 opposing the holding surface 12, a shaft 3 for moving the processing section 5 and the holding surface 11 relatively, and a shaft 4 for moving the processing section 6 and the holding surface 12 relatively. When the works W are suction held to the opposite sides of the work table 2 and processed, the number of works to be processed can be doubled using an apparatus having a work table of the same diameter and thereby the throughput can be enhanced. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008084887(A) 申请公布日期 2008.04.10
申请号 JP20060259644 申请日期 2006.09.25
申请人 TOKYO SEIMITSU CO LTD 发明人 SUZUKI TOMOHIRO
分类号 H01L21/301 主分类号 H01L21/301
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