| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite wiring board material which is excellent in reliability of through hole plating. SOLUTION: The composite wiring board material comprises (A) insulating film, (B) adhesive layer containing epoxy resin and curing agent, and (C) protective film or copper foil. A linear expansion factorα1 of the adhesive layer in X-Y plane direction at -50 to 250°C as well as a linear expansion factorα2 in Z axis direction are 100 ppm/°C or less, respectively. COPYRIGHT: (C)2008,JPO&INPIT
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