发明名称 Wiring board
摘要 In a conventional wiring board, it is not possible to effectively attract electric charges provided by a charged body to a side surface of a wiring board and, therefore, it cannot be said that sufficient measures against static electricity have been taken for the wiring board. A wiring board including: an insulating layer (L 2 ); a conductive layer (Lc 2 ) overlaid on the insulating layer (L2); and an insulating layer (L 1 ) overlaid oh the conductive layer (Lc 2 ), wherein the conductive layer (Lc 2 ) is connected to a ground potential node and is configured inclusive of a plane part ( 20 ) formed planar within the plane of the wiring board (SUB) and a plurality of protruding parts ( 21 ) extending from the plane part ( 20 ) toward the side faces of the wiring board (SUB), protruding faces ( 22 ) forming the front edges of the protruding parts ( 21 ) are exposed at the side faces of the wiring board (SUB), and thus a plurality of the protruding faces 22 are disposed at the side faces of the wiring board (SUB).
申请公布号 US2008083984(A1) 申请公布日期 2008.04.10
申请号 US20070905721 申请日期 2007.10.03
申请人 NEC ELECTRONICS CORPORATION 发明人 KAGAWA TAKASHI
分类号 H01L23/48;H05K1/00 主分类号 H01L23/48
代理机构 代理人
主权项
地址