发明名称 |
IMPROVED PROCESS FOR PRESSURELESS CONSTRAINED SINTERING OF LOW TEMPERATURE CO-FIRED CERAMIC WITH SURFACE CIRCUIT PATTERNS |
摘要 |
This invention relates to a process which produces crack-free, non-camber, distortion-free, zero-shrink, LTCC bodies, composites, modules or packages from precursor green (unfired) laminates of multilayer structure with one or more different dielectric tape chemistries that are patterned with co-fireable thick film circuitry materials such as conductor, via fill, capacitor, inductor, or resistor for each tape layer including both top and bottom surface tape layers in direct contact with the sacrificial release tape. |
申请公布号 |
WO2007149298(A3) |
申请公布日期 |
2008.04.10 |
申请号 |
WO2007US13963 |
申请日期 |
2007.06.13 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY;WANG, CARL, B.;SMITH, MICHAEL, ARNETT |
发明人 |
WANG, CARL, B.;SMITH, MICHAEL, ARNETT |
分类号 |
H05K3/46;H05K1/03 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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