APPARATUS AND METHOD OF PROCESSING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To well dry a substrate surface while preventing a watermark from occurring on the substrate surface in an apparatus and a method of processing the substrate for drying the substrate surface wetted with a process liquid by means of a solvent with low surface tension such as IPA.

SOLUTION: The method of processing the substrate includes steps of rinsing the substrate surface Wf by discharging a rinse liquid (DIW) from a rinse liquid outlet 96a provided on a shielding member 9 while supplying nitrogen gas into a gap space SP and replacing the rinse liquid attaching to the substrate surface Wf with a mixed liquid by discharging the mixed liquid (IPA+DIW) from a mixed liquid outlet 97a provided on the shielding member 9 while supplying nitrogen gas into the gap space SP. A dissolved oxygen concentration in the mixed liquid can thus be prevented from rising when the rinse liquid attaching to the substrate surface Wf is replaced with the mixed liquid, thereby surely preventing an oxide film from forming on the substrate surface Wf or the watermark from occurring.

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