| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive adhesive capable of improving conductivity, without increasing the manufacture processes of a product to be stuck, and to provide a piezoelectric device that utilizes the adhesive. SOLUTION: In the piezoelectric device, an electrode part 26 for connection of a piezoelectric vibration piece 20 is fixed to an electrode part 40 for mounting of a package 30 by using the conductive adhesive where a conductive filler 42b is contained in a resin component 42a. The conductive adhesive 42 contains the conductive filler 42b, a metal material 46, and the resin component 42a, whose hardening rate on the boundary of the metal material 46 is smaller than the hardening speed on the boundary of the conductive filler 42b. COPYRIGHT: (C)2008,JPO&INPIT
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