| 摘要 |
PROBLEM TO BE SOLVED: To prevent the short-circuit of solder in a reflow process by preventing the printed solder from spreading out on a pad due to weight at component mounting and component weight resulting in contact with an adjacent solder when a low pitch LCC package is mounted. SOLUTION: The short-circuit of solder caused by pressurization and displacement at the time of LCC mounting is prevented by preparing a means for establishing a processing hole for soldering in a spacer and supplying and fixing solder and a means for connecting the electrode pad of the LCC with the pad of a substrate via the solder fixed in the processing hole for soldering. COPYRIGHT: (C)2008,JPO&INPIT
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