| 摘要 |
<p>A positive photoresist composition is provided to improve adhesiveness with a metal deposited on a resist, superior leveling property, and compatibility with a developer, and to be developable in an aqueous potassium hydroxide solution. A positive photoresist composition contains a compound represented by the following formula 1 or 2. In the formula 1, each of a, b, and c represents a hydrogen atom, or a C1-10 alkyl or alkoxy group, and each of l, m, and n represents an integer of 1-10. In the formula 2, each of a, b, c, and d represents a hydrogen atom, or a C1-10 alkyl group or alkoxy group, and each of l, m, n, o, and p represents an integer of 1-10.</p> |
