发明名称 MANUFACTURING PROCESS AND INSPECTION METHOD OF ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing process and an inspection method of an electronic device having a strip connection conductor. <P>SOLUTION: The manufacturing process of a semiconductor device 10 having a strip connection conductor 16 for connecting an electrode pad 14 (first connection part) and a lead terminal 15 (second connection part) comprises a step for determining the frequency characteristics of the oscillation speed of the connection conductor 16 by oscillating the semiconductor device 10 while sweeping the oscillation frequency f, a step for comparing the frequency characteristics of the oscillation speed of the connection conductor 16 with first reference frequency characteristics and determining first comparison result, a step for determining the frequency characteristics of the oscillation speed of a test component 41 by oscillating a known test component 41 while sweeping the oscillation frequency, a step for comparing the frequency characteristics of the oscillation speed of the test component 41 with second reference frequency characteristics and determining second comparison result, and a step for detecting a connection failure portion of the connection conductor 16 based on the first and second comparison results. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008084881(A) 申请公布日期 2008.04.10
申请号 JP20060259510 申请日期 2006.09.25
申请人 TOSHIBA CORP 发明人 TAKEDA YOSHIHIRO;MIKI KENICHI;MIYAZAKI TSUTOMU;HASHIMOTO KAZUNORI;MORIMOTO MASATO
分类号 H01L21/60;G01R31/26 主分类号 H01L21/60
代理机构 代理人
主权项
地址