PATTERN FLAW INSPECTION METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a pattern flaw inspection method of a semiconductor device capable of efficiently performing review inspection of high precision near to all-points inspection. SOLUTION: An operator can accurately perform review inspection with respect to the place detected by a flaw inspection machine 1 by referring to the image data of a pattern having the flaw produced on the basis of a coordinates file excepting a duplicate pattern. The reference of the pattern is performed by producing a binary pattern and navigating the review place. COPYRIGHT: (C)2008,JPO&INPIT