| 摘要 |
PROBLEM TO BE SOLVED: To enlarge the minute electrode terminals of a semiconductor element by rewiring and to perform face-down bonding to a mounting board on which formation of terminals at a minute pitch is difficult. SOLUTION: A series of bump terminals 31 and 32 are formed on at least one of a semiconductor element 1 and a mounting board 2, a filmlike adhesive 4 having enlargement wiring 5 formed previously is sandwiched between the semiconductor element 1 and a mounting board 2 and hot pressed temporarily. Subsequently, the filmlike adhesive 4 is penetrated by the bump terminals 31 and 32, and connection and sealing of the terminals between the semiconductor element 1 and a mounting board 2 are performed simultaneously through the enlargement wiring 5. COPYRIGHT: (C)2008,JPO&INPIT
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