FILM COATING APPARATUS

摘要

A gas is jetted from a sonic nozzle toward the rear surface of a wafer. The flow speed of the gas flowing to the outer circumference side along the rear surface of the wafer is increased between the rear surface of the wafer and a second cup and is kept by Bernoulli's effects. Thus, rocking of wafer is suppressed. Furthermore, a resist solution is prevented from flowing around to the rear surface.