Method for fabricating copper line in semiconductor device,申请号KR20020037207-传众专利搜索

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发明名称	Method for fabricating copper line in semiconductor device
摘要
申请公布号	KR100820780(B1)	申请公布日期	2008.04.10
申请号	KR20020037207	申请日期	2002.06.29
申请人		发明人
分类号	H01L21/28;(IPC1-7):H01L21/28	主分类号	H01L21/28
代理机构		代理人
主权项
地址

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