| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for a light emitting element which is excellent in heat dissipation properties and can be manufactured at a low cost, and a light emitting device. <P>SOLUTION: The wiring board for the light emitting element comprises: a planar metal substrate 1 composed of a sintered metal; a loading part 11 for loading the light emitting element 23 formed on one main surface of the metal substrate 1; a through insulator 3 composed of ceramics passing through the metal substrate 1; a through conductor 5 electrically insulated from the metal substrate 1 and passing through the inner side of the through insulator 3; wiring 7 electrically connected to the through conductor 5, insulated from the metal substrate 1 and provided around the loading part 11; and a reflection part 9 composed of the sintered metal formed so as to surround the loading part 11 and the wiring 7. The metal substrate 1, the through insulator 3, the through conductor 5, the wiring 7 and the reflection part 9 are simultaneously baked. <P>COPYRIGHT: (C)2008,JPO&INPIT |
