| 摘要 |
PROBLEM TO BE SOLVED: To bond in parallel a substrate having solid state imaging elements and a sealing substrate for sealing the solid state imaging elements together. SOLUTION: The manufacturing apparatus for a solid state imaging apparatus of this invention comprises a bonding unit 40 for bonding a wafer 10 as a substrate having the solid state imaging elements and a transparent substrate 20 as a sealing substrate for sealing the solid state imaging elements. The bonding unit 40 has an upper stage 42 and a lower stage 43 opposed to each other, the transparent substrate 20 is held on the upper stage 42 and the wafer 10 having the solid state imaging elements is held on the lower stage 43. The upper stage 42 is provided with parallelism adjusting pins 44 for adjusting the mutual parallelism between the stages 42 and 43, and the mutual parallelism between the stages 42 and 43 is adjusted by the contact between the parallelism adjusting pins 44 and the lower stage 43 opposed to the parallelism adjusting pins 44. COPYRIGHT: (C)2008,JPO&INPIT
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