| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device improving a heat-dissipating property by radiation fins while maintaining a flexibility, and to provide electronic equipment with the electronic device. SOLUTION: The electronic device has a thin-film device 1 having the flexibility and a plurality of mutually separated radiation fins 3 formed on the thin-film device 1. Each radiation fin 3 is molded in a tapered shape. Thermal conductive adhesive layers 2 are interposed among the radiation fins 3 and the thin-film device 1. The adhesive layers 2 are divided into several parts on a substrate. The adhesive layers 2 are molded in a sheet shape, and interposed among the radiation fins and the thin-film device 1. COPYRIGHT: (C)2008,JPO&INPIT
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