发明名称 |
ELECTRONIC COMPONENT TESTING APPARATUS |
摘要 |
<p>Provided is an electronic component testing apparatus for testing an IC device (IC) by bringing the IC device (IC) into electrical contact with a contact section of a test head. The electronic component testing apparatus is provided with a device transfer apparatus (310) for transferring the IC device (IC) from a customer tray (800) positioned at a window section of a loader section to a test tray. The device transfer apparatus (310) is provided with a holding head (340) for holding the IC device (IC), and the holding head (340) holds the IC device (IC) stored in the customer tray (800) by bringing the IC device (IC) close from a noncontact state.</p> |
申请公布号 |
WO2008041334(A1) |
申请公布日期 |
2008.04.10 |
申请号 |
WO2006JP319870 |
申请日期 |
2006.10.04 |
申请人 |
ADVANTEST CORPORATION;SAGAWA, MAKOTO |
发明人 |
SAGAWA, MAKOTO |
分类号 |
G01R31/26;H01L21/66;H01L21/67 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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