发明名称
摘要 A vibration wave driven apparatus which makes it possible to secure a required component accuracy obtained by machining and can increase a power ratio to the size of the apparatus. A plurality of contact parts are formed on one surface of an elastic vibration plate of a vibrator, and are disposed in contact with a friction member of a slider. A piezoelectric element plate is joined to the other surface of the vibration plate. Thinner parts as recessed parts are formed in the vibration plate at locations other than the contact parts, whereby the vibration plate is disposed in contact with the friction member of the slider at the contact parts.
申请公布号 JP4072518(B2) 申请公布日期 2008.04.09
申请号 JP20040171641 申请日期 2004.06.09
申请人 发明人
分类号 H02N2/00;H01L41/09 主分类号 H02N2/00
代理机构 代理人
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