| 摘要 |
<p>It is an object of the invention to present an adhesive sheet (4) for laser dicing capable of dicing the workpiece into individual small pieces of element securely at high production efficiency when forming a reformed region inside the workpiece by light absorption ablation of a laser beam, and a manufacturing method therefore. It is also an object of the invention to present a method of manufacturing small pieces of element securely at high production efficiency by using such an adhesive sheet (4) for laser dicing. The invention describes an adhesive sheet (4) for laser dicing used for dicing into individual chips by forming a reformed region inside of a workpiece by light absorption ablation of laser beam, in which the adhesive sheet (4) has an adhesive layer (2) at least on one side of a base material (1), and at least the base material (1) surface not contacting with the adhesive layer (2) is provided with an arithmetic average height (Ra) of at least 0.4 mu m so that it is free from convex parts of width (W) of 20 mm or less and height (h) of 1 mu m or more, and concave parts of width (W) of 20 mm or less and depth (d) of 1 mu m or more when the adhesive sheet is glued to the workpiece. <IMAGE></p> |
