发明名称 SEMICONDUCTOR DEVICE
摘要 Each of first base regions of sequentially layered first IGBT and second IGBT has a peripheral section in the vicinity of the side face of the semiconductor substrate. Each of the IGBTs includes a P-type peripheral base region that is adjacent to the peripheral section of the first base region of the N-type to form a diode and a diode electrode that is formed on an upper face of the peripheral section of the first base region, thereby electrically connecting the diode electrode and a collector electrode of each of the IGBTs. When the semiconductor device is ON, current flows at the center side of the semiconductor substrate separated from the side face. When current in a reverse direction is generated when the semiconductor device is OFF, current in a reverse direction flows in the vicinity of the side face of the semiconductor substrate.
申请公布号 EP1909329(A1) 申请公布日期 2008.04.09
申请号 EP20060729670 申请日期 2006.03.22
申请人 SANKEN ELECTRIC CO., LTD. 发明人 TORII, KATSUYUKI
分类号 H01L29/739;H01L25/04;H01L27/00;H01L27/04;H01L27/088;H01L29/78 主分类号 H01L29/739
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