<p>A microstructure relay is provided, having a body that includes upper and lower portions. The lower portion is formed from a substrate, and the upper portion is formed on the substrate to avoid bonding of the lower portion to the upper portion. A support member is fixed to the body at a first end of the support member to form a cantilever, wherein an upper surface of the support member and a lower surface of the upper portion of the body form a cavity. A first contact region is located on the upper surface at a second end of the support member. The first contact region comprises a first contact, wherein pivoting the support member toward the lower surface causes the first contact to be electrically coupled to a counter contact.</p>
申请公布号
EP1166352(B1)
申请公布日期
2008.04.09
申请号
EP19990902030
申请日期
1999.02.04
申请人
INSTITUTE OF MICROELECTRONICS;TYCO ELECTRONICS LOGISTICS AG
发明人
UPPILI, SRIDHAR;VICTOR, D., SAMPER;FOO, PANG, DOW;WAGENAAR, DIRK;KAY, KRUPKA;SCHLAAK, HELMUT