| 摘要 |
When a multilayer electronic component having a ceramic substrate and a resin layer is mounted on a mounting substrate, the thickness of solder used in the above mounting is made not to interfere with reduction in size and height of an electronic device including the above multilayer electronic component. Recess portions (8, 9) are formed at an outside-facing major surface (7) side of a resin layer (5). In the resin layer (5), columnar conductors (10, 11) are disposed so that axis line directions thereof are aligned in a thickness direction of the resin layer (5). End portions (14, 15) of the columnar conductors (10, 11) are located inside the recess portions (8, 9) further from opening faces thereof and have end surfaces (16, 17) exposed in the recess portions (8, 9). When a multilayer electronic component (1) is mounted on a mounting substrate (26), solder is provided on the end surfaces (16, 17) of the columnar conductors (10, 11) in the recess portions (8, 9). |
