发明名称 Non-metal mesh cover for metal chassis
摘要 The present invention relates to a chassis structure for an electronic system containing a plurality of electronic components therein. The present invention provides a composite chassis structure comprising a nonmetal mesh cover formed on one or more surfaces of the metal chassis to obtain additional thermal budget and human-friendly chassis surface.
申请公布号 US7355849(B2) 申请公布日期 2008.04.08
申请号 US20060512515 申请日期 2006.08.30
申请人 VIA TECHNOLOGIES, INC. OF R.O.C. 发明人 KU SHIH-CHANG
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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